PICMG’s COM Express standard offers designers flexibility in power sequencing, I/O definition, and other criteria, allowing the highly integrated off-the-shelf building blocks to be used in a variety of embedded computing applications. But this freedom of choice can limit the interchange-ability from one vendor’s carrier board to another’s. A recently formed PICMG subcommittee that includes several small form factor manufacturers is endeavoring to increase compatibility among COM Express modules from various vendors by defining a set of carrier design guidelines that enable plug-and-play support. Jeff Munch, ADLINK CTO and chairman of the COM.0 Carrier Design Guide Subcommittee, took a moment to enlighten PC/104 and Small Form Factors about the design guide and how it will advance the adoption of COM Express.