When high-performance processing is a must in harsh conditions, old processors and inferior graphics capabilities won’t cut it. That’s why Advanced Digital Logic’s ADLQM67PC SBC uses a (Sandy Bridge) 2nd Gen Intel Core i7 processor and Intel’s HD Graphics 300 engine with Advanced Vector Extensions (AVX). The QM67 PCH’s PCI-Express I/O provides 5 Gbps bandwidth, twice the speed of 1st Gen i7 or Core 2 Duo platforms. All this power still leaves room for many other useful features in rugged applications.

The SBC has a variety of I/O ports, including discrete 16-bit digital I/O, VGA, LVDS, HDMI, and DisplayPort interfaces. Additionally, it comes with 2x RS232 COM ports, 2x SATA 6 Gbps with RAID support, 8x USB 2.0, two bootable GbE LAN, HDA 7.1, and Type 1 bottom-stacking PCI Express v2.0 supporting a Gen2 throughput of 5 GT/s. All this comes in a 4.5" x 3.8" PCI/104-Express form factor. Extreme temperatures won’t slow it down with a -25 °C to +70 °C temperature range and an extended -40 °C to +85 °C version available, and active and passive thermal solutions keep it from overheating. For transportation and railway applications that require high-performance capabilities, it’s hard to go wrong with a Sandy Bridge-based SBC.

Your data is going nowhere, even if you find yourself in some far- reaching and rugged conditions. Emphase’s Slim SATA S6 solid state storage flash drive was designed to go through industrial and other rugged environments unscathed, without sacrificing capacity or performance. And it’s designed to keep it up for years – more than 4 million hours MTBF, Emphase says – with minimal performance degradation. It’s capable of 2 to 128 GB of storage space, and transfer speeds of up to 230 MBps read and 180 MBps write. A wear-leveling algorithm that can distinguish between static and dynamic data extends the drive’s life for more reliability. Optional conformal coating can help it get through tough conditions like up to 90 percent humidity, 1,500 g/0.5 ms shock, 20 g vibration, and an extended temperature range of -40 °C to +80 °C. The 4 mm thick drive uses SLC NAND flash in a 54 mm x 39 mm x 6.8 mm MO-297 JEDEC standard package that fits in Mini-ITX and Nano-ITX form factors, no matter where they are.

Can you hear me now? The answer is “of course” when Eurotech’s DynaVIS 10-00 connected rugged display is handling communications networks, even in harsh environments. Built-in GPS also helps pinpoint its location. A wide range of communications interfaces – wired and wireless, including WiFi, 3G, and GbE – allows the platform to fit in rail, bus, and other demanding vehicle applications. It’s also ready to handle some pretty tough industrial environments with a -25 °C to +55 °C operating temp. range and a 95 percent humidity rating, in addition to an IP65 rating and compliance with a host of railway standards such as shock and vibration.

The display has a 5.7" resistive color touchscreen with a backlit ±70° viewing angle display. Based on a 1.1 GHz Intel Atom processor, it has some horsepower while still staying low power at 19 W. And even though it’s compact at 230 mm x 140 mm x 61.7 mm, it still has a full load of connectivity features with optoinsulated I/Os, serial ports, and USB in addition to a range of power supply options. Taking the DynaVIS 10-00 on the road is an easy choice.

Fast cars can’t be held up with a slow start. Portwell’s PCS-8277 in-vehicle telematics PC keeps embedded transportation systems fast by beating the clock with a 5-second boot time, even while loaded with high- performance features. And unlike some high-maintenance Ferrari, this speed racer is easy to maintain. It boasts an AMD G-T56N 1.6 GHz processor and a Radeon HD 6310 graphics engine in a fanless design, and Coreboot technology upshifts the traditional x86-based platform with a fast boot feature. Communication is a breeze with 3.5G, WLAN, Bluetooth, and GPS support. An externally accessible HDD/SSD bay makes maintenance and upgrade easier.

MIL-STD-810F certification renders vibration during harsh off-roading a non-factor, while an intelligent delayed boot/shutoff mechanism with surge protection also helps the system stay reliable in sometimes-unpredictable transportation environments. Put the pedal to the metal for in-vehicle signage, in-bus and -train surveillance systems, fleet dispatch, and remote management applications with the PCS-8277.

When you think about how much more advanced today’s smartphones are than the computer on something as mission critical as the Apollo 11, it’s no wonder Blue Chip Technology looked to smartphone chip tech when designing their RE2 SBC. The company says they wanted to exploit the maximum performance, minimal footprint, reliability, and low power usage seen in smart phones for a compact and feature-rich SBC. It accomplishes this with an ARM Cortex A8 processor, Texas Instruments C64x DSP, and a range of peripherals.

The high-performance unit comes with GPS, GPRS, WiFi, Bluetooth, and networking peripherals, along with USB, camera, audio, and powerful graphics capabilities. The Cortex A8 and C64x DSP combination allows it to handle intense graphics processing while not taking away from the peripherals. Typical power usage is around 2 W, so it won’t break the power bank in in-vehicle applications. And a -40 °C to +85 °C extended temperature availability makes the RE2 a good fit for high-performance rugged industrial applications such as graphical HMI modules.

Good preparation is essential, especially on important missions. Vocality’s BASICS IP keeps field computers prepared to run tasks with all the data-handling capacity they need, even when space, bandwidth, and power are constrained. The IPsec-secure, high-speed router is ready to serve in many tactical and satellite applications.

For the small form factor market, the BASICS platform is available as a PC/104-size board sheathed in a heat jacket for optimal heat management. Generally, routing protocols include BGP, OSPF, and RIPv2. The router boasts an auto-negotiating four-port switch, PoE support, Vocality’s VOS 7 OS, and optional TCP acceleration and serial data aggregation to 25 Mbps. IPv6 routing is available this year in addition to IPv4. The unit includes an assortment of other features such as QoS/bandwidth pool management, jitter buffer optimization, and SNMPv3 MIB-II reporting. Vocality’s network router was recently selected for the FALCON tactical communication system used by the British Army and Royal Air Force, proving its preparedness for active duty.

Do giants tread lightly, or have little feet? Logic says no, but General Micro Systems’ “Depot” SX401R-4 Network Attached Storage (NAS) system is a lightweight, tiny “giant,” with up to 1 TB storage in a 2.5 lb, 6” x 3.5” x 3” (63 cubic inch) footprint. Compliant to MIL-STD-810G, MIL-STD-704E, and MIL-STD-461F, it’s also rugged and ready to fit in harsh-environment applications.

Available as a conduction-cooled, extended temperature (-40 °C to +85 °C) unit, the NAS system is low power and includes a DO-160 Power Conditioner module to handle unreliable power sources, and full power management control, giving it low S, W, and P marks. In addition to its low-power qualities and “SWaP-bustable” nature, it offers big storage options, with up to four removable, sealed SSD drives at 256 GB each, and an additional 64 GB of internal SSD storage for the OS and HWD Write-Protect. It supports Windows XP/XPE/7, Linux, and VxWorks. A NanoSBC module (the XPC40x) gives the NAS system its big performance with a 1.6 GHz processor, 512 KB of L2 cache, 3D acceleration for high-performance graphics, and a variety of ports.

Pros stay on their game in tough situations, and so does ADLINK Technology’s rugged MXE-3000 embedded computer. It’s hard to break this reliable performer equipped with a whopping 100 g shock tolerance. And its small size makes it a good fit for a wide range of applications, from medical management and digital signage to industrial automation and transportation, especially in-vehicle systems.

This rugged embedded computer runs fanless from -20 °C to +70 °C and includes an industrial SSD. Along with being robust enough to withstand harsh conditions with 5 Grms vibration resistance, it also has flexible I/O options, including six USB 2.0 ports. Its two COM ports can be configured to RS-232/422/485. And there are no worries about getting tripped up, as its cableless design gets rid of the need for cable management. Put the Intel Atom D510 dual core processor-powered MXE-3000 in rough applications, and it won’t break a sweat.

When projects always seem to be running behind deadlines, having a module that’s built for speed and ease of design without sacrificing performance provides a real boost. Emerson Network Power’s “ready-to-go” COMX-Pxxx pluggable mezzanine modules are designed to accelerate time-to-market and have a powerful Freescale QorIQ processor for high performance.

The 95 mm x 125 mm COMX-P3041, COMX-P4040, and COMX-P5020 COM Express modules can be mounted on a carrier and are flexible enough to fit in a range of enclosures. This flexibility extends to the multitude of I/O options, including 12 configurable SERDES lanes in addition to 10G XAUI, Serial RapidIO, GPIO, USB 2.0, PCI Express, Gigabit Ethernet, and real-time debug. The three modules’ QorIQ processors come in 1.5 to 2.0 GHz, dual- and quad-core varieties targeting different strengths. Applications include embedded computing in the military/aerospace, industrial, and enterprise markets. The COMX-Pxxx modules let designers focus on tailoring products to the needs of their applications and stay up to speed with fast deadlines.

Legacy software is an inescapable part in the development of some embedded systems, and bits of legacy software tag along in most systems. But developers need not fear. To the rescue is Eurotech’s CPU-1440 PC/104-Plus board, which eases legacy support with x86 capacity from DOS applications all the way up to current Linux and Windows CE applications. PC/104 and PC/104-Plus bus expansion paired with ISA support in an easy-to-use, efficient platform nods to new designs or legacy hardware upgrades.

Fanless up to 4 W, the low-power, rugged board is fitting for industrial, point-of-sale, and transportation applications that require durable construction and high reliability. With 128 MB of soldered down RAM and a 2 MB onboard flash disk with -40 °C to +70 °C extended temperature range options, it can withstand some pretty tough environments. But working with it doesn’t have to be tough: The development kit includes a variety of preinstalled OSs and drivers for a quick start to application development. This board is like a good trainer for an old cranky legacy dog needing to keep up with a new pack of puppies.

Getting Android applications to communicate with a wide variety of devices can feel like forcing a square peg into a round hole. They can even be ill- fitting with other Android applications due to the platform’s fragmentation. But Objective Interface Systems’ ORBexpress for Android middleware can shape applications to fit any platform or device, regardless of the destination’s operating system, programming language, or architecture.

Android’s current software development kit makes connecting apps easy on the same device, but off the device is out of the question. The ORBexpress framework, on the other hand, drills down on Android to put applications onto PCs, other mobile devices, enterprise networks, and pretty much anything else. The lightweight middleware, based on industry-standard CORBA technology, provides many mechanisms for communicating between devices including Web servers and direct peer-to-peer communications. The background communication and data exchange between the different devices aims for lightning-fast UI response times. And, it’s reliable enough to use in mission-critical systems, the company says. Voila: Rigid becomes flexible.

The infotainment bandwagon is taking off, and it’s as good a time as any to look at options and get ready to hop on. Kontron is making the leap a bit shorter with its KTA55/pITX, available in Q3 this year. This small, fast 2.5" Pico-ITX embedded single board computer is primed and ready for graphics-intensive development in digital signage and sales kiosks.

Based on the AMD Embedded G-Series with Fusion technology, the SBC can handle DirectX 11 and pump out 1080i/p full-HD video to dual-screen displays, while still in a low-power mode of 9 W TDP with a 5 V power supply. The board integrates up to two 64-bit processor cores, a programmable graphics unit, plus PCI Express Gen 2.0 and DDR3 RAM controllers. Processor options include 1.2 GHz Single-Core processor AMD T44R or the 1.0 GHz Dual-Core processor AMD T44N for multithreading oomph. With all the graphics capabilities, there’s a load of add-on storage options with two 6.0 Gbps SATA connections capable of handling current SSD transfer rates and a microSD slot that’s also bootable. This Pico-ITX SBC is looking pretty good for the future of graphics-based infotainment development.

Embedded systems’ graphics need to look like what the latest gaming rigs can put out, making the hardware that sorts through it all require better processors and more memory to tackle the added strain. LiPPERT Embedded Computers’ Toucan-QM57 COM Express module aims for the high score list with an Intel Core i7 first-gen processor and the RS-DIMM rugged memory module, standardized by the SFF-SIG in February 2011.

To balance all the processing power of this tough little COM Express module, the company pairs its hardware with LiPPERT Enhanced Management Technology (LEMT) to measure its supply current and therefore the CPU’s power consumption in real time. In addition to its up to 8 GB DDR3 ECC RAM, the RS-DIMM module allows for memory expansion, which is a great match for systems dealing with image processing, video encoding, and other demanding applications. It packs an arsenal of external port options including 8 USB 2.0 host ports, 4 SATA ports with RAID support, 1 PATA interface, dual-channel LVDS, 2 DisplayPort connectors, and Gigabit LAN. Its powerful graphics functionality, complemented with Intel HD audio, is a rugged knock-out.

Even with the move to increasingly lower-power devices, it’s not “no power.” With any power requirement, a source is needed, and in some places that’s hard to come by. The PCI Systems DesertGecko UPS 1000 is rugged enough to go through hell and back while still providing portable, constant power. Mobile and deployed systems particularly benefit from this small-footprint chassis.

The armored UPS, engineered with lithium iron phosphate technology, is guaranteed to deliver with a long life cycle of more than 2,000 charges and 650 W of power, according to the company. This means high availability where local power supplies are fickle at best. This steady trouper can also deal with too much energy, able to survive overcharge up to 40 V without damage during which it is protected from fire and explosions, says PCI-Systems. Operating at -20 °C to +70 °C and conduction cooled, its performance is not affected by extreme heat or cold. It provides full power conditioning, full EMI shielding, thermostat-controlled fans, replaceable dust filters, over-voltage protection circuitry, and even lightning protection in severe weather. The MIL-STD-810F-certified chassis is available in 1/2 ATR and horizontal radio type mounts. This little Gecko is ready to stand firm in the harshest environments.

Getting started can be the hardest part of the design process. But VIA Technologies has made prototyping hardware and software designs easier with the VIA AMOS-5001 chassis kit. Whether or not the final design uses VIA’s x86 CPUs or the Em-ITX form factor, it’s still a useful platform to begin with and makes that whole getting started thing much more doable.

The plethora of I/O options through interchangeable front and rear panels makes the kit a flexible aid to medical, industrial, digital signage, and surveillance systems. The -20 °C to +55 °C operating temperature, fanless kit also has a rugged side, capable of handling anti-shock up to 50 g and is vibration-resistant for extra reliability. The compact, 35.2 mm x 231.44 mm x 124.8 mm design is crunched down for maximum space efficiency for electromagnetic compatibility. The tiny kit allows for an optional 2.5" HDD storage subsystem chassis, letting all the squeezed-in bits stretch out. Common I/O ports have external cutouts for easy external access, and it uses a modular design and just four mechanical parts for easy assembly and maintenance. This flexible kit measures up to be tough enough to withstand harsh conditions but is moldable to many different applications.

Mission- and safety-critical applications leave no room for error when one software bug can prove disastrous, so everything has to be right. And, with software sources diverging from in-house to outsourced and other third-party suppliers, bugs can be hiding in all sorts of cracks and crevices in the code. Having a single management tool streamlines the code review process to prevent defects and substandard code from causing delays and expensive recalls. Coverity’s Integrity Control helps check all those sources’ software contributions against the same criteria to provide early warnings to risks and prepare for extermination.

The code governance platform works in conjunction with Coverity’s Static Analysis to add visibility to software testing and quality verification. Through Integrity Control, developers can set the rules of thresholds in quality, security, efficiency policy, and SLA compliance; pinpoint where violations in those policies occur; and alert the development team with a Coverity Software Integrity Report summarizing the defects sneaking around in their code. By keeping everyone in the software development process on the same page, organizations can be sure that bugs have nowhere to hide.

Open source software is increasingly used in the embedded world; in addition to having the right products and tools to implement it, you need the right knowledge. Timesys has taken on an open source attitude by giving developers free access to the Timesys University, an embedded Linux training program set up in tracks of four 60-minute biweekly sessions. Coursework utilizes Timesys’ LinuxLink software development framework to make going back to school a little more fun with hands-on Linux tasks for embedded applications and popular processors.

Students of the “University” are taken through a curriculum of the whole development process including an inspection of the underlying hardware; basic requirements of designing and deploying Linux; creating BSPs and SDKs on popular processors and boards; and optimizing, testing, and integrating the design. Raise a virtual hand and ask expert instructors questions about the unique components to embedded Linux development. Upcoming tracks include building a user interface for a medical device and building a connected home automation device. “Students” can also go back and view recordings of old sessions they missed. Get ready to ace practical Linux development “tests” out in the real world.

Getting started can be the hardest part of the design process. But VIA Technologies has made prototyping hardware and software designs easier with the VIA AMOS-5001 chassis kit. Whether or not the final design uses VIA’s x86 CPUs or the Em-ITX form factor, it’s still a useful platform to begin with and makes that whole getting started thing much more doable.

The plethora of I/O options through interchangeable front and rear panels makes the kit a flexible aid to medical, industrial, digital signage, and surveillance systems. The -20 °C to +55 °C operating temperature, fanless kit also has a rugged side, capable of handling anti-shock up to 50 g and is vibration-resistant for extra reliability. The compact, 35.2 mm x 231.44 mm x 124.8 mm design is crunched down for maximum space efficiency for electromagnetic compatibility. The tiny kit allows for an optional 2.5" HDD storage subsystem chassis, letting all the squeezed-in bits stretch out. Common I/O ports have external cutouts for easy external access, and it uses a modular design and just four mechanical parts for easy assembly and maintenance. This flexible kit measures up to be tough enough to withstand harsh conditions but is moldable to many different applications.

The old axiom “less is more” is certainly true when a plate of international fare such as grasshoppers atop rice is set on the dinner table. However, Acromag is taking the adage in a different direction with its new APMC4110 bus-less PMC module carrier card, enabling stand-alone PMC module use. Highly suitable for test systems and bench prototyping, the Xilinx Virtex-5 FPGA-sporting carrier card eliminates the need for costly computer chassis or card cages, and you won’t need the CPU card, rack, or backplane either.

So what does the carrier card do all day? Specifically, it is geared to effectively relay signals in adapter style, to and from the PMC. System lockups upon local-bus connection are thwarted as the carrier card regulates start-up of the PCI bus and powers the PMC module. Fewer external power connections are needed with APMC4110 as well, thanks to the DC/DC converter sitting on the board, rendering +3.3 VDC from the module’s +5 VDC external source. And, finally, troubleshooting rapidly becomes fait accompli, via the card’s boundary scan debugging courtesy of a 14-pin Xilinx JTAG connector.

It’s not a credit card, but it’s the same size as one. Indeed, Artila Embedded Computing & Communications’ M-502 System-on-Module (SOM) measures a mere 50 x 80 mm … perfect to pull out of an engineer’s arsenal and slide into an industrial application such as energy-saving systems, building automation, scenario control systems, and Intelligent Transportation Systems (ITSs). With a 400 MHz ARM926EJ-S processor complete with Memory Management Unit (MMU) at the helm, the M-502 is ready to rock and roll on the embedded scene – while consuming an ultra-low 2.5 W. Meanwhile, memory comprises 2 MB DataFlash to aid in system recovery, in addition to 128 MB NAND flash and 64 MB SDRAM.

And this SOM is no “plain Jane.” Rather, it is conveniently suited up with Linux 2.6.29, and sports hardware device drivers, a busybox utility collection, and lighttpd Web server. And the I/O is plenteous: one 10/100 Mbps Ethernet, four UARTs, two USB 2.0, and 32 programmable digital I/Os. Additionally, interfaces include I2C, Serial Peripheral Interface (SPI), Secure Data Card (SD), 8-bit local bus, and an I2S bus.

Scientists such as Albert Einstein, Isaac Newton, and Thomas Edison all did their share of experimenting on ideas, as do modern embedded systems designers. But one thing modern rugged systems designers don’t want to experiment on or leave to chance is their system’s tenacity in harsh environments, which is one of the reasons ADLINK Technology’s “rugged by design” CoreModule 745 caught our eye.

Inherently rugged from the ground up (hence, the “rugged by design” designation), the CoreModule 745 is a Size, Weight, and Power (SWaP) savvy, Atom-based PC/104-Plus SBC utilizing various strains of the Atom processor including the 1.66 GHz N450 or even the dual-core D510 variant. TDP bottoms out at a miniscule 9 W, and the multicore-capable, stackable module “enables conduction-cooled solutions” and “simplifies cooling requirements,” the company says. Built tough for the avionics, military, industrial, and transportation industries, the SBC enables IA-controller addition to the system, sans any custom carrier board. I/O encompasses PCI and ISA buses, along with 1 GbE port, serial ports, and up to 2 GB DDR2 667 MHz RAM.

It is extremely likely that anything at the recent CES was as outrageously attention-getting as musician-turned-Polaroid’s-creative-director Lady Gaga’s revelation of photo-taking sunglasses. But we think that Corsair’s “Corsair Link” technology, designed for provision of “unparalleled” PC control, is just as noteworthy – at least to SFFs designers utilizing PCs in their embedded systems. The reason: The Corsair Link connectors facilitate key parametric data reports pertaining to the PC’s power consumption, fan speed, voltage, pump speed, and temperature, for example.

Like pretty much all things hardware, software is the enabler: in this case, CoolIT Systems’ software, which remains unnamed at present. But the operation works thusly: Users have the option to set up profiles via a drag-and-drop interface, to control myriad parameters and devices. One scenario could be a “maximum performance” profile, through which the user can ramp up the radiator fan speed, instruct fans to run at maximum levels, keep track of cooling fluid and CPU or GPU temps, or adjust case lighting, for instance. Corsair Link technology is featured on the company’s Dominator/Dominator GT modules and Hydro Series H60 wares, and is coming soon to a CPU cooler or PSU near you.

Compatibility can be determined with the aid of a horoscope, online dating service, or a partnership between two SFF companies. Connect Tech and congatec have collaborated on a design that marries Connect Tech’s PCI/104-Express SBC with congatec’s Qseven module, creating a scalable CPU board with access to current and future generations of the Intel Atom processor. The Xtreme/CPU embedded carrier board supports a full range of PCI/104-Express add-on cards and enables integration with any Qseven module.

Joining the modules together adds Qseven’s features to the PCI/104-Express board, rendering a total of four x1 PCI Express lanes plus GbE, LVDS, VGA video, two RS-232 and two RS-422/485, four USB 2.0, and two SATA ports. This I/O platform enables rapid prototyping and is available in customized versions for meeting specific price and time-to-market goals. With a temperature range of -20 °C to +70 °C, the Xtreme/CPU is targeted for low-power embedded applications.

Security DVR systems and other applications that operate round the clock can rack up the charges on electricity bills. These systems as well as battery-powered portable devices can benefit from the low power consumption (less than 15 W TDP) offered by BCM’s NX510D. Designed based on Intel’s two-chip layout architecture, which saves board space and provides efficient routing and heat flow, the Nano-ITX motherboard offers 1.66 GHz dual-core processing performance and Hyper-Threading Technology with the Intel D510 processor.

In addition to incorporating Gigabit LAN, GPIO, Mini PCI Express, two COM, and four USB ports, the NX510D features an onboard DC-in connector supporting 12 V DC power and Trusted Platform Module (TPM 1.2) for data security. The integrated Intel GMA 3150 engine enables dual-display functionality via 18-bit LVDS and VGA output and supports 384 MB video memory and DirectX9, making the board capable of driving display monitors in digital signage applications.

While COMs can be used in a wide variety of applications, that flexibility doesn’t do much good without software to develop those applications. After releasing a starter kit for nanoETXexpress earlier this year, Kontron has introduced another tool, the Kontron microETXexpress Starterkit VxWorks, to help developers jump-start COM designs and reduce time to market.

Validated for use under Wind River VxWorks 6.8, the kit comes with preconfigured components including a microETXexpress module with a 1.6 GHz Intel Atom Z530 or N270 processor, 1 GB DDR SODIMM memory, heat sink, Kontron ETXexpress-miniBaseboard, 12 V pico power supply, and other accessories. Additional features include a 2 GB USB stick with a preinstalled bootable VxWorks 6.8 demo image plus Wind River Tilcon Graphic demo applications and an 8 GB Wind River LiveUSB environment stick with Wind River Workbench 3.2 (30-day evaluation) and the Wind River Tilcon Interface Development Tool 5.7.

When it comes to rugged PCs, like with hot peppers, sometimes the smaller the size, the greater the power or, in the case of habaneros, the pungency. Stealth.com’s new LPC-100 is the company’s smallest and most powerful mini PC to date, measuring 4" x 6.1" x 1.45" and integrating the Intel Dual Core Celeron T3100 (1.9 GHz) or optional Intel Core 2 Duo P8400 (2.26 GHz) or T9400 (2.53 GHz) processors.

Weighing just 1.2 lbs, this paperback-sized SFF computer features 3D graphics with 16x9 capability, up to 500 GB internal storage, an external 12 VDC power adapter, and an optional solid-state hard drive. I/O includes three USB 2.0, two serial, one DVI-I video, and two PS/2 ports plus Gigabit LAN. Housed in a low-profile aluminum chassis, the LPC-100 is designed for rugged industrial and commercial applications such as digital signage, kiosks, thin clients, and HMI systems.

Like the U.S. Postal service, SFFs deployed in harsh environments must weather the elements and deliver the goods as promised. Designed for this very purpose, the COM-630E from ARBOR Technology provides 1.1 GHz processing with the Intel Atom Z510PT CPU and can be designed with a non-conductive material coating to prevent corrosion caused by moisture, salt fog, rain, or other severe environmental conditions typically found in industrial, transportation, and military applications.

In addition to its Intel SCH US15WPT chipset and 1 GB soldered DDR2 SDRAM, the COM Express module packs in plenty of graphics capabilities with the Intel GMA500 chipset, which supports 2D/3D graphics, HD video, decode, image processing, and shader-based technology. Interface connectivity is easy to accomplish with eight USB ports, two IDE ports, and PCI and PCI Express slots through the carrier board. The COM-630E is fanless and rated for -40 °C to +85 °C operating temperature.

Compatibility can be determined with the aid of a horoscope, online dating service, or a partnership between two SFF companies. Connect Tech and congatec have collaborated on a design that marries Connect Tech’s PCI/104-Express SBC with congatec’s Qseven module, creating a scalable CPU board with access to current and future generations of the Intel Atom processor. The Xtreme/CPU embedded carrier board supports a full range of PCI/104-Express add-on cards and enables integration with any Qseven module.

Joining the modules together adds Qseven’s features to the PCI/104-Express board, rendering a total of four x1 PCI Express lanes plus GbE, LVDS, VGA video, two RS-232 and two RS-422/485, four USB 2.0, and two SATA ports. This I/O platform enables rapid prototyping and is available in customized versions for meeting specific price and time-to-market goals. With a temperature range of -20 °C to +70 °C, the Xtreme/CPU is targeted for low-power embedded applications.

Slimming down is not just a goal for those trying to fit into their old jeans; it’s also a growing trend in embedded technologies. Viking Modular Solutions is getting into the thinning act by introducing the Slim SATA SSD, a rugged, caseless Solid-State Drive that’s less than half the size of a 2.5" SSD. Conforming to the JEDEC MO-297 industry standard, the SSD offers a 3 Gb SATA II interface and sustained performance of up to 260 MBps.

Provided in densities of 25 GB, 60 GB, or 120 GB, Slim SATA features intelligent write management techniques and an advanced controller for data path CRC error detection and protection against flash page, block, and die failures. Equipped with AES-128 encryption and advanced SMART command support, Slim SATA can be configured using MLC or SLC flash technologies. The industrial-grade SSD is well-suited for embedded server and storage systems, gaming, and aerospace and defense applications.

As discussed in this issue’s features on MIL-SPEC and industrial apps, small form factors must be hardy enough to handle the rough and tumble conditions of military equipment, factory floors, and other volatile environments. MM50, the latest in MEN Micro’s ESMini COM family, tackles the ruggedization challenge head-on with 512 MB of DDR2 SDRAM that can withstand severe shock of 15 g, 11 ms; bump of 10 g, 16 ms; and vibration of 1 g from 10 Hz to 150 Hz (sinusoidal).

Equipped with a PowerPC MPC5121e or MPC5123 processor, the MM50 offers low power dissipation (3 W max), 3D graphics capabilities, and up to 128 KB of non-volatile FRAM and mass storage expansion. An optional version with a conduction-cooling frame provides full EMC protection.